Introducing a newly shipped PCB based on the RO4003C material. The RO4003C PCB, utilizing Rogers Corporation's proprietary woven glass reinforced hydrocarbon/ceramics materials, combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This groundbreaking PCB offers exceptional performance and cost-effectiveness, making it an ideal choice for a wide range of applications.
Key Features:
Unmatched Electrical Performance: The RO4003C PCB boasts an impressive dielectric constant (DK) of 3.38 +/- 0.05 at 10GHz, ensuring accurate signal transmission and reception. With a low dissipation factor of 0.0027 at 10GHz, it minimizes signal loss, providing superior performance in high-frequency applications.
Enhanced Thermal Management: Engineered with a thermal conductivity of 0.71 W/m/°K, the RO4003C PCB excels at dissipating heat efficiently. Its low coefficient of thermal expansion (CTE) matched to copper (11ppm/°C in the X-axis, 14ppm/°C in the Y-axis) guarantees thermal stability, even in extreme temperature conditions (-50°C to 150°C).
Cost-Effective Solution: The RO4003C PCB offers the same processing method as standard epoxy/glass, eliminating the need for special through-hole treatments or handling procedures. This results in lower fabrication costs compared to conventional microwave laminates, making it an economical choice for high-performance applications.
Versatility and Reliability: Designed for multi-layer board (MLB) constructions, the RO4003C PCB is ideal for performance-sensitive, high-volume applications. Its competitive pricing, combined with exceptional electrical characteristics, ensures reliable and cost-effective solutions.
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Featuring a 2-layer rigid PCB stackup with a copper layer thickness of 35 μm (outer layers) and a Rogers 4003C core thickness of 0.508 mm (20mil), this PCB provides a solid foundation for your projects. It has a board dimension of 43.88mm x 33.2 mm, allowing for compact and efficient layouts.
With a minimum trace/space of 5/5 mils and a minimum hole size of 0.3mm, the RO4003C PCB supports intricate and precise circuit designs. It has a finished board thickness of 0.6mm and a finished copper weight of 1oz (1.4 mils) on outer layers, ensuring durability and reliability.
Each PCB undergoes rigorous testing, with 100% electrical testing performed prior to shipment, ensuring its quality and adherence to IPC-Class-2 standards. The availability of worldwide shipping ensures easy access to this high-performance PCB.
Some typical applications of the RO4003C PCB include cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNB's for direct broadcast satellites. Choose the RO4003C PCB to unleash the power of high-frequency performance in your advanced applications. Trust Rogers Corporation's expertise in cutting-edge PCB materials for superior results.
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20mil RO4003C PCB 2 Layer Immersion Gold High Frequency Circuits Images
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